ULVAC Vietnam Representative Office

Dry Etching System for R&D NLD-570

Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.


  • Low process pressure, high density plasma, low electron temperature are perfect for quartz glass, Pyrex, LN, LT etc.
  • Good profile control and surface roughness.
  • Good performance of deep SiO2 etching with PR.
  • High etching rate of Quartz > 1μm/min, Pyrex > 0.8 μm/min.
  • Excellent uniformity control.
  • Cassette chamber is selectable as an option.


  • Optical Devices (Wave guide, amplifier, optical switch etc), Micro lens, Photonics, μ-TAS etc.