Dry Etching System for R&D NLD-570

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Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Features

Low process pressure, high density plasma, low electron temperature are perfect for quartz glass, Pyrex, LN, LT etc.
Good profile control and surface roughness.
Good performance of deep SiO₂ etching with PR.
High etching rate of Quartz > 1μm/min, Pyrex > 0.8 μm/min.
Excellent uniformity control.
Cassette chamber is selectable as an option.

applications

Optical Devices (Wave guide, amplifier, optical switch etc), Micro lens, Photonics, μ-TAS etc.