Dry Etching Tool APIOS NE-950EX
LED Mass Productive Dry Etching Tool NE-950EX
Features
- Higher Through-Put（by 140% than conventional systems)
3 wafers batch processing availability in 6inch dia.
7 wafers batch processing availability in 4inch dia.
12 wafers batch processing availability in 3 inch dia.
29 wafers batch processing availability in 2 inch dia. - ICP with magnetic field(ISM *1), high density plasma source which has over 600 delivery record in compound semiconductor market is equipped.
*1:ULVAC Patent No.3188353 - Propriately Star electrode*2 which has self-cleaning function for deposited material from RF window is equipped.
*2:ULVAC Patent No.3429391 - High mentenancability, stability, reliability are achieved through re-deposition preventative designing.
- Dry etching technology availability for various process application. (GaN, Sapphire, Metal, ITO, SiC, AlN, ZnO, 4 elements compound semiconductor materials, etc.)
- Various Option availability
applications
- Dry etching of GaN, Sapphire, metal, ITO etc for LED product
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ULVAC Vietnam Representative Office
29/11/100 Le Duc Tho Street, Ward 7, Go Vap District Ho Chi Minh City, Vietnam
5/5/42 Thanh Binh Street, Hai Duong Province, Vietnam