Luminous NA series ashing systems can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
High dose ion implant stripping process and polymer removal process of 10E + 16 or higher level that are necessary for critical process for next generation wafers can be implemented free of damages.
Chamber construction is arranged most suitably for an F-based gas addition process, and particle-free treatment is possible. Therefore, it is suitable to construct an extremely wide range of processes from normal PR to high dose ion implant stripping process, organic films (such as PI and DFR) peeling and oxidized film etching.
A simple system construction is adopted, achieving “excellent maintainability and reliability” and “low cost” at the same time.
Flexible system construction is possible (μ wave, RIE, and μ wave + RIE ), allowing a wide range of transfer channel selection.
Wafer size can be switched by simply changing the recipe setting, achieving very easy wafer size change.
High dose ion implant stripping process (10E + 16 or higher) and polymer removal in front end process
Wafer process that requires CF-4 addition process (electronic parts and LEDs)
Chip size package and bump process
CCD color filter manufacturing process
100mm, 125mm, 150mm and 200mm
200mm and 300mm
ULVAC Vietnam Representative Office
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