Non-volatile Material Etching Tool ULHITETMNE-7800H
ULHITETM NE-7800H is the cluster type etching system of low-pressure and high-density plasma for NVM materials(difficult etch materials, used for FeRAM, MRAM, ReRAM, CBRAM, PCRAM etc.),dielectric, noble metals and Magnetic Layers.
Features
- High-temperature (up to 450ºC) substrate electrode.
- Mechanism for reducing deposition of dielectric film on RF input window
- High etching rate
- Outstanding stability of Pt/Ir/magnetic films etching
- ISMTM (Inductively Super Magnetron) high-density plasma source.
applications
- FeRAM, MRAM, ReRAM, CBRAM, PcRAM, etc.
specifications
| Item | Specification |
| System configuration | Cassette chamber/auto-loader |
| Transfer chamber | |
| Etching chamber | |
| Preheating chamber (option) | |
| Ashing chamber (option) | |
| Supported substrate sizes | 6/8 inches |
| Film types | Ferroelectric/high-k materials, magnetic materials, electrode materials, other |
| Uniformity within substrate surface | ±5% max. |
| Plasma source | ISM (ICP with magnetic field) |
| Substarate electrode temperature | Up to 400ºC±5ºC |
| Anti-deposition measures | Faraday shield mechanism, Top plate heating mechanism, Deposition shield heating mechanism, etc |
| Process recipe editing | Multi-step type |
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ULVAC Vietnam Representative Office
29/11/100 Le Duc Tho Street, Ward 7, Go Vap District Ho Chi Minh City, Vietnam