Dry Etching System for Opto-Devices, MEMS NLD-5700

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Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Features

ICP type etching chamber, CCP or Ashing chamber is also selectable as 2nd chamber.
Low process pressure, high density plasma, low electron temperature are perfect for quartz glass, Pyrex, LN, LT etc.
Good profile control and surface roughness.
Good performance of deep SiO₂ etching with PR.
High etching rate of Quartz > 1μm/min, Pyrex > 0.8 μm/min.
Excellent uniformity control.

applications

Optical Devices (Wave guide, amplifier, optical switch etc),　Micro lens, Photonics, μ-TAS etc.