A Batch System to Remove Native Oxide RISETM-300
Batch type equipment of chemical dry cleaning for remoral of native oxide in Narrow and Deep-contact patterns of advanced semiconductor.
Features
- Damage-free (remote plasma and low-temperature process)
- High throughput and low CoO
- Processing in batches of fifty wafers
- Superior uniformity of etching (5% or less per batch)
- Easy maintenance
- Small foot print compare to cluster type equipment
- 50% lower self-aligned contact resistance compared to current wet process
- The Smallest foot print
applications
- Pre-cleaning for self-aligned contact (SAC) formation
- Pre-cleaning for capacitor formation
- Pre-cleaning for epitaxial growth
specifications
| Model | RISETM-300 | |
| Plasma Source | Microwave Power Supply | |
| Configuration | EFEM + LL + PM | |
| Wafer Size | 300mm diameter | |
| Wafer Stage | Ceramic Board (50 wafers/batch) | |
| Pumping System | Etching Module:Mechanical booster pump +DRP | |
| Control System | FAPC+TFT Touch Panel | |
| Gas Supply | 3 lines | |
| Application | Pretreatment for SAC, Capacitor, Epitaxial growth | |
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ULVAC Vietnam Representative Office
29/11/100 Le Duc Tho Street, Ward 7, Go Vap District Ho Chi Minh City, Vietnam