ULVAC Vietnam Representative Office

A Batch System to Remove Native Oxide RISETM-300

Batch type equipment of chemical dry cleaning for remoral of native oxide in Narrow and Deep-contact patterns of advanced semiconductor.


  • Damage-free (remote plasma and low-temperature process)
  • High throughput and low CoO
  • Processing in batches of fifty wafers
  • Superior uniformity of etching (5% or less per batch)
  • Easy maintenance
  • Small foot print compare to cluster type equipment
  • 50% lower self-aligned contact resistance compared to current wet process
  • The Smallest foot print


  • Pre-cleaning for self-aligned contact (SAC) formation
  • Pre-cleaning for capacitor formation
  • Pre-cleaning for epitaxial growth


Plasma SourceMicrowave Power Supply
ConfigurationEFEM + LL + PM
Wafer Size300mm diameter
Wafer StageCeramic Board (50 wafers/batch)
Pumping SystemEtching Module:Mechanical booster pump +DRP
Control SystemFAPC+TFT Touch Panel
Gas Supply3 lines
ApplicationPretreatment for SAC, Capacitor, Epitaxial growth