Load-lock type Sputtering System CS-200
Load-lock type Sputtering System CS 200 is for research & development and small production application.
Features
- Substrate transfer capability up to Φ300mm (Deposition performance up to Φ200mm).
- Automatic multi-layered deposition by recipe control.
- Capable of automatic substrate transfer by simply loading the substrate on to manipulator in the Load-lock chamber.
- Cassete chamber available five substrates stocker inside of load-lock chamber.
- Co-sputtering and Multi-layer deposition using multi cathodes.
- Bias-sputtering available with optional substrate Bias power supply.
applications
- R&D
- Small production purpose
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ULVAC Vietnam Representative Office
29/11/100 Le Duc Tho Street, Ward 7, Go Vap District Ho Chi Minh City, Vietnam
5/5/42 Thanh Binh Street, Hai Duong Province, Vietnam