ULVAC Vietnam Representative Office

Load-lock type Sputtering System CS-200

Load-lock type Sputtering System CS 200 is for research & development and small production application.


  • Substrate transfer capability up to Φ300mm (Deposition performance up to Φ200mm).
  • Automatic multi-layered deposition by recipe control.
  • Capable of automatic substrate transfer by simply loading the substrate on to manipulator in the Load-lock chamber.
  • Cassete chamber available five substrates stocker inside of load-lock chamber.
  • Co-sputtering and Multi-layer deposition using multi cathodes.
  • Bias-sputtering available with optional substrate Bias power supply.


  • R&D
  • Small production purpose