ULVAC Vietnam Representative Office

Backside Metalization Sputtering System SRH Series

SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.


  • Applicable substrate size: Φ125 to 200mm.
  • Capable of auto-transfer for Ultra-thin Si wafer up to 50μm thickness.
  • Up to 5 unique process recipes.
  • Sputter-Etching process developed by ISM.
  • Efficient water cooling mechanism by ESC method is available.


  • Power device
  • WL-CSP (seed layer of electrolytic plating)
  • UBM (Barrier metal)