Backside Metalization Sputtering System SRH Series

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SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

Features

Applicable substrate size: Φ125 to 200mm.
Capable of auto-transfer for Ultra-thin Si wafer up to 50μm thickness.
Up to 5 unique process recipes.
Sputter-Etching process developed by ISM.
Efficient water cooling mechanism by ESC method is available.

applications

Power device
WL-CSP (seed layer of electrolytic plating)
UBM (Barrier metal)