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| SV-200 | SV-4540 | SV-6040 | SV-9045 | ||
| Standard evacuation system | 8-inch cryopump | 12-inch cryopump | 12-inch cryopump | 16-inch cryopump | |
| Final pressure | 6.7e-5Pa | 6.7e-5Pa | 6.7e-5Pa | 6.7e-5Pa | |
| Deposition direction | Side | Side | Side | Side | |
| Deposition area uniformity Static Rotary | Φ200mm ± 5% | L300mm ± 10% | L300mm ± 10% | L400mm ± 10% | |
| Substrate heating | None | 250°C | 250°C | 250°C | |
| Control system | Automatic | Automatic | Automatic | Automatic | |
| Options (except SV-200) | Turbo pump | Drainage cold electrode |
| Oil diffusion pump | APC mechanism | |
| Simultaneous multi-source deposition | Substrate reversing mechanism | |
| Down deposition | Reactive sputter | |
| Conventional cathode | ||
| Cathode for strong magnets | ||
| RF etch cleaning (SV-4540) | ||
| Bias mechanism (SV-4540) |

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29/11/100 Le Duc Tho Street, Ward 7, Go Vap District Ho Chi Minh City, Vietnam
5/5/42 Thanh Binh Street, Hai Duong Province, Vietnam