ULVAC Vietnam Representative Office

Load-lock type Plasma-CVD System CC-200/400

CC-200/400 is a compact and easy-to-use system for R&D use and production.


  • High-density plasma process on 27.12MHz
  • Supports the deposition of SiH4 (SiO2, SiNx, SiON, a-Si ) and TEOS (SiO2).
  • Supports the chamber cleaning by CF4+O2 plasma.
  • Supports the heater for low-temperature deposition of organic EL.
  • Supports various substrate sizes.
  • Vacuum box-enabled indirect sequential processing within C-series (Sputter: CS-200, Evaporation: CV-200).


  • Power devices
  • Compound-related devices of LED, LD and highspeed devices
  • Organic EL system for R&D use
  • Solar battery system for R&D use
  • MEMS