Home / product / Vacuum Equipments / Etching System / High-Density Plasma Etching System for R&D NE-550EX
Item | Specification |
System configuration | R&D/prototype system with Load Lock function |
Substrate size | Up to 150 mm |
Operating pressure (Pa) | 0.07 to 6.7 |
Uniformity within substrate/substrate to substrate surfaces | ±3% max. |
Substrate temperature control | Electrostatic chuck |
29/11/100 Le Duc Tho Street, Ward 7, Go Vap District Ho Chi Minh City, Vietnam
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